Semiconductor CMP Slurry

ACESOL® CMP Slurry Series

CMP (Chemical Mechanical Planarization) is a critical semiconductor process that chemically and mechanically polishes the wafer surface to achieve a high degree of planarity across each process layer.

CMP slurry is a key material that determines polishing performance, selectivity, defect control (e.g., scratches), and surface quality. As such, optimized slurry formulations are required for different film materials.

The ACESOL® Series offers high-performance CMP slurries specifically engineered to match the characteristics of various semiconductor materials and process requirements. With excellent polishing performance and stable process characteristics, the ACESOL® Series helps customers improve productivity, process stability, and manufacturing yield.

Oxide CMP Slurry

Poly CMP Slurry 

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Cu Bulk Slurry 

Cu Barrier Slurry 

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[Product Inquiry] 

Choi Dong-rak  PL   :  drchoi@acenanochem.com

Benjamin Kim  Pro :  benjaminkim@acenanochem.com